DeepCool EX750 High Performance Thermal Paste (3g)
The DeepCool EX750 is an industrial-grade thermal interface material (TIM) engineered for enthusiast-level cooling. It is designed to minimize thermal resistance between high-performance CPUs/GPUs and their cooling solutions.
Technical Specifications
- Thermal Conductivity: 6.2 W/m·K
- Thermal Impedance: 0.03°C·cm²/W
- **Specific Gravity (25°C): 2.6 g/cm³
- Operating Temperature Range: -50°C to +250°C
- Net Weight: 3 grams (typically provided as 2x 1.5g syringes in some packaging)
Physical Properties
- Consistency: Smooth, gel-like consistency designed for easy spreading and filling of microscopic surface imperfections.
- Electrical Conductivity: Non-conductive (Safe for use near electronic components; prevents short circuits).
- Corrosiveness: Non-corrosive and non-toxic.
Key Highlights
- Low Thermal Resistance: Optimized for high-heat scenarios like overclocking or intensive rendering, ensuring maximum heat transfer to the heatsink.
- Stability: Highly stable compound that does not dry out or bleed easily under long-term high-temperature exposure.
- Application: Suitable for both Desktop and Laptop applications (CPU and GPU).
- Volume: The 3g quantity is generally sufficient for multiple applications (approximately 5–10 standard CPU applications depending on the method used).
Package Contents
- 1x (or 2x) Syringe of EX750 Thermal Paste.
- 1x Spreader/Spatula (usually included for even application).
- Cleaning wipes (included in some retail versions for surface preparation).
